The Recognition and Capture of Wafer Probe Marks in IC Package Using Computer Vision
碩士 === 國立彰化師範大學 === 電機工程學系 === 105 === Semiconductor is a highly automatically industry, but semiconductor companies rely on engineers using eyeball analysis to judge wafer defect, like probe mark inspection during chip probe (CP). The probe mark will reduce wire bonding strange at chip assembly and...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/9uq53d |