Study of Using Carrier with Auxiliary Rack to Enhance Plating Performance

碩士 === 國立彰化師範大學 === 電機工程學系 === 105 === The Plating carrier is a pylon to guide current in hanging plating operation. Its role is to fix plated parts and put into the plating tank for plating or preparation. Plating carrier structure type is very pluralistic and usually decided by plated part’s shape...

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Bibliographic Details
Main Authors: Lin,Pi-Sung, 林碧鬆
Other Authors: Chung,I-Neng
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/7w432e
Description
Summary:碩士 === 國立彰化師範大學 === 電機工程學系 === 105 === The Plating carrier is a pylon to guide current in hanging plating operation. Its role is to fix plated parts and put into the plating tank for plating or preparation. Plating carrier structure type is very pluralistic and usually decided by plated part’s shape structure and size. In this study, the additional auxiliary rack is equipped with conventional electroplating. Comparing to the conventional plating carrier which only use the carrier and solution to conduct, this study uses additional auxiliary rack to increase the contact area between the carrier and material. It makes the color coating more uniform and upgrades the electrical conductivity at the same time to ensure the quality of the output products, improve the traditional plating carrier efficiency and problems of uneven coating. In this study, it was confirmed that the electroplating vehicle system with the attached pendant was much better than the conventional electroplating vehicle system without using the attached pendant under the same environment and plating conditions. Among them, equipped with five pendant with the plating vehicle system is better than carrying three pendant with the plating vehicle system. Through the expansion of the number of attachments in the form of the product yield can be raised to 95% or more, the production efficiency of about 10 %. Additional accessories not only conducive to improve the quality of the plating, also reduce the contact area between the case and the electrical conductivity and other adverse factors of output.