A Dual-Symptom Aging Monitor for Data-Delivery TSVs in 3D-ICs
碩士 === 國立彰化師範大學 === 電子工程學系 === 105 === Three-dimension (3D) integration has become the key solution for reviving the Moore's Law from scaling limits due to process, voltage and thermal variations, as well as power dissipation and interconnection delay. Recent ITRS reports that interconnects, es...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/2tjtd2 |