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• Main Authors: Jian-Fong He, 何建鋒
• Other Authors: 李天錫
• Format: Others
• Language: en_US
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/6h57uw

碩士 === 國立中央大學 === 機械工程學系在職專班 === 105 === Abstract The application of HMDS (Hexamethyldisilazane) in semiconductor lithography process is mainly explain in this report. In semiconductor Lithography process, it includes Priming, HMDS (Hexamethyldisilazane), Resist Coating, Exposure, Develop, Baking and Measurement. For semiconductor Lithography process, the value of the final measurement will very base on the parameter settings that were enter for each process. The optimization of parameter settings come from multiple experiments and compare results with each other. For experiment’s parameter settings, it is based on the required specifications depend on each product. The motivation of studying HMDS (Hexamethyldisilazane) comes from the defect of pattern from the product of customer. The reason of defect for pattern is because of the pattern of wafer exposure. In order to discover the reason of failure, this report will focus on the research of Hexamethylsilazane for improvement of process.