A Resistance Welding Method with in-situ Temperature Sensors for Microsystem Packaging
碩士 === 國立交通大學 === 機械工程系所 === 105 === This paper proposed several methods to improve the bounding property of a wafer-level packaging technology which was proposed by our research team previously. The bounding method employed in this technology is to use the conventional resistance welding to fac...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/k65mst |