Investigation of Asymmetry Hybrid Bonding Using Cu/Sn & Cu/Cu Bonding with Polyimide for 3D Heterogeneous Integration Applications
碩士 === 國立交通大學 === 電子研究所 === 105 === Wafer bonding technology plays an important role to pursue small form factor and high performance for 3D integration. However, in order to achieve high density 2.5D/3D integration, the dimension and pitch of micro bumps continue to scale down. It becomes more and...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2017
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/y47qtk |