Development of Low Temperature Cu Bonding and Heterogeneous Integration Platform
博士 === 國立交通大學 === 電子研究所 === 105 === This dissertation focuses on researches of three-dimensional integrated circuit, including development of key technologies and using technologies for the construction of heterogeneous integration platform. Studies focus on the physical mechanism of bonding technol...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/y2b7ft |