Effect of Sn Microstructure on Electromigration and Thermomigration in Sn2.3Ag Microbumps
博士 === 國立交通大學 === 材料科學與工程學系所 === 105 === Microbump plays an important role to connect chips in three-dimensional integrated circuit (3D IC) technology. With the reduction of solder volume, the increase in current density and thermal gradient has raised serious reliability concern during electromigra...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42731029402804192866 |