Point to Point Microwave Transmission Equipment Thermal Analysis

• Main Authors: Ou,I-Feng, 歐伊峰
• Other Authors: 傅武雄
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/29xx7s

碩士 === 國立交通大學 === 工學院精密與自動化工程學程 === 105 === In recent years, owing to the popularity of wireless network communication technology following the increase in cellphone users, the network communications equipment industry has been actively developing high-performance, lightweight products in low volumes. A back-end transmission processing unit combines multiple types of network communication integrated circuit (IC) chips, which release energy in the form of heat during the computing process. Heat build-up can shorten the service life of IC chips, which in turn causes an unexpected reduction in product life span. As a countermeasure, heat should be effectively transferred to the phone case. The present study analyzed the internal heat transfer process of point-to-point microwave transmitters. Heat was transferred out of an enclosed environment to reduce heat build-up. A computational fluid dynamics simulator program was then used to compare the difference in the internal heat transfer process under the presence and absence of a thermal conductive material.