Reduction of Acid Gas Pollution in The Chemical Supply Area of A Semiconductor Factory

碩士 === 國立交通大學 === 工學院永續環境科技學程 === 105 === The clean room standard was controlled by the number of particles; it is controlled by the concentration of Airborne Molecular Contaminations (AMCs) due to the advanced semiconductor wafer manufacturing process. Therefore, it is critical for the semiconducto...

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Main Authors: Chung, Shang-Jen, 鍾尚仁
Other Authors: Tsai, Chuen-Jinn
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/v575u3
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spelling ndltd-TW-105NCTU50870012019-05-15T23:32:20Z http://ndltd.ncl.edu.tw/handle/v575u3 Reduction of Acid Gas Pollution in The Chemical Supply Area of A Semiconductor Factory 半導體晶圓廠化學供應區酸性氣體污染改善研究 Chung, Shang-Jen 鍾尚仁 碩士 國立交通大學 工學院永續環境科技學程 105 The clean room standard was controlled by the number of particles; it is controlled by the concentration of Airborne Molecular Contaminations (AMCs) due to the advanced semiconductor wafer manufacturing process. Therefore, it is critical for the semiconductor fab constriction to control AMCs. When the supply system is not properly maintained, the AMCs of acids, alkalis, and organic compounds are likely to be produced. The parallel plate wet denuder (PPWD) and Ion Chromatography‎(IC) are used to analyze the AMCs in the chemical supply area of the semiconductor fab in this study. The improvement of standard operational procedures to reduce the AMCs is also discussed. There are two scenarios in this study. Scenario 1 is the improvement of HCI supply system maintenance pollution. Scenario 2 is the improvement of HF drum replacement work pollution. The sampling concentration before operating the improvement scenario 1 was 4,616 ppbv which is closed to the national standard TLV-STEL of 5ppm. It is also within the AMCs pollution standards of 0.1ppm. A mobile compartment local exhaust equipment was designed for the study; its concentration was 0.4ppbv after the maintenance. The concentration was reduced to 0.15 ppbv after operating for 15 minutes. Therefore, it is indicated that an appropriate use of mobile compartment local exhaust equipment can effectively capture HCl pollutants, and can promptly remove contaminants. The improvement scenario 2 is HF drum replacement work pollution. The sampling concentration before operating the improvement scenario 2 was 42ppbv. The concentration was reduced to 8 ppbv after operating for one hour. It takes two hours to reach the concentration at below 2 ppbv by changing the environment. There are three different variables in this study. Variable 1: Increasing the negative pressure exhaust (the wind velocity of 0.2 m/s) in the supply system internal cabinet; its sampling concentration was 29ppbv. The result shows that variable 1 has a slight effect on the removal of internal cabinet contaminants. Variable 2: Switching off the supply system HEPA air supply; its sampling concentration was 120ppbv. The result shows that variable 2 has no effect on the removal of internal cabinet contaminants. Nevertheless, it increases the probability of the environment pollution. Variable 3: Changing the position of chemical drum and hood openings from a vertical direction to a parallel direction; its sampling concentration was 1.9ppbv. The result shows that variable 3 can effectively remove contaminants and prevent from spreading to the environment. Tsai, Chuen-Jinn 蔡春進 2016 學位論文 ; thesis 48 zh-TW
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language zh-TW
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description 碩士 === 國立交通大學 === 工學院永續環境科技學程 === 105 === The clean room standard was controlled by the number of particles; it is controlled by the concentration of Airborne Molecular Contaminations (AMCs) due to the advanced semiconductor wafer manufacturing process. Therefore, it is critical for the semiconductor fab constriction to control AMCs. When the supply system is not properly maintained, the AMCs of acids, alkalis, and organic compounds are likely to be produced. The parallel plate wet denuder (PPWD) and Ion Chromatography‎(IC) are used to analyze the AMCs in the chemical supply area of the semiconductor fab in this study. The improvement of standard operational procedures to reduce the AMCs is also discussed. There are two scenarios in this study. Scenario 1 is the improvement of HCI supply system maintenance pollution. Scenario 2 is the improvement of HF drum replacement work pollution. The sampling concentration before operating the improvement scenario 1 was 4,616 ppbv which is closed to the national standard TLV-STEL of 5ppm. It is also within the AMCs pollution standards of 0.1ppm. A mobile compartment local exhaust equipment was designed for the study; its concentration was 0.4ppbv after the maintenance. The concentration was reduced to 0.15 ppbv after operating for 15 minutes. Therefore, it is indicated that an appropriate use of mobile compartment local exhaust equipment can effectively capture HCl pollutants, and can promptly remove contaminants. The improvement scenario 2 is HF drum replacement work pollution. The sampling concentration before operating the improvement scenario 2 was 42ppbv. The concentration was reduced to 8 ppbv after operating for one hour. It takes two hours to reach the concentration at below 2 ppbv by changing the environment. There are three different variables in this study. Variable 1: Increasing the negative pressure exhaust (the wind velocity of 0.2 m/s) in the supply system internal cabinet; its sampling concentration was 29ppbv. The result shows that variable 1 has a slight effect on the removal of internal cabinet contaminants. Variable 2: Switching off the supply system HEPA air supply; its sampling concentration was 120ppbv. The result shows that variable 2 has no effect on the removal of internal cabinet contaminants. Nevertheless, it increases the probability of the environment pollution. Variable 3: Changing the position of chemical drum and hood openings from a vertical direction to a parallel direction; its sampling concentration was 1.9ppbv. The result shows that variable 3 can effectively remove contaminants and prevent from spreading to the environment.
author2 Tsai, Chuen-Jinn
author_facet Tsai, Chuen-Jinn
Chung, Shang-Jen
鍾尚仁
author Chung, Shang-Jen
鍾尚仁
spellingShingle Chung, Shang-Jen
鍾尚仁
Reduction of Acid Gas Pollution in The Chemical Supply Area of A Semiconductor Factory
author_sort Chung, Shang-Jen
title Reduction of Acid Gas Pollution in The Chemical Supply Area of A Semiconductor Factory
title_short Reduction of Acid Gas Pollution in The Chemical Supply Area of A Semiconductor Factory
title_full Reduction of Acid Gas Pollution in The Chemical Supply Area of A Semiconductor Factory
title_fullStr Reduction of Acid Gas Pollution in The Chemical Supply Area of A Semiconductor Factory
title_full_unstemmed Reduction of Acid Gas Pollution in The Chemical Supply Area of A Semiconductor Factory
title_sort reduction of acid gas pollution in the chemical supply area of a semiconductor factory
publishDate 2016
url http://ndltd.ncl.edu.tw/handle/v575u3
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