Research on EM Modeling of Bondwire-Interconnection between 60-GHz Vital-Signs Doppler Radar RF Sensor Chip and Millimeter-Wave Planar Antenna

• Main Authors: Cheng-HsuehChan, 詹承學
• Other Authors: Huey-Ru Chuang
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/fne8v4

碩士 === 國立成功大學 === 電腦與通信工程研究所 === 105 === This thesis presents the research on EM modeling of bondwire-interconnection between 60-GHz human vital-signs Doppler radar RF sensor chip and millimeter-wave planar patch-array antenna. It is to replace the cable connection between the chip and antenna by a low-loss bondwire matching network during the measurement [4][5] and for the practial vital-signs detection application. The implemented bondwire-interconnection can integrate the 60-GHz sensor chip and planar antenna on the four-layer composite PCB fabricated by Rogers RT/duroid 5880 and FR4 substrates. It also improves the vital-signs detection range by this integrated radar module than the cable connection configuration of the antnna and the chip. In this research, the bondwire matching network is employed to realize conjugate matching between the chip and antenna. An L-C-L structure is adopted to form a T-matching network. Besides, parallell bondwires and floating open-ended stubs are applied in the matching network. Measurement results indicate that the total loss of bondwire-interconnection at 60 GHz is 3.1 dB, from the Friis power transmission formula. For the experiment of non-contact vital-signs detection, the demonstrated measurement results show that the low-loss bondwire-interconnection significantly enhances the human vital-signs detection distance up to 105 cm, which is 1.4 times greater than that using the cable connection.