On the Kinetics and Mechanism of IMC Growth and Electrified Tensile Intergranular Fracture of Fine Silver Alloy Wires
博士 === 國立成功大學 === 材料科學及工程學系 === 105 === The growth kinetics of intermetallic compound (IMC) of the Ag alloy wires and Al Pad was discussed, and the damage of excessive current density were investigated by electrified test and the dynamic current tensile (DCT) test. Observations on the Ag-8Au-3Pd wir...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/j999mp |