Fabrication of Multi-Dimensional Metallic Micro-Interconnections with Molten Lead-Free Solder by Piezoelectric Ink-jet Printing Method

博士 === 國立成功大學 === 材料科學及工程學系 === 105 === Inkjet printing technology has made great improvements in print quality and reproduction speed, and is now widely used in the modern electronics packaging industry. The merits of this approach include variable drop size, high precision in positioning, rapid pr...

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Bibliographic Details
Main Authors: Chien-HsunWang, 王建勛
Other Authors: Weng-Sing Hwang
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/53m3r3