The Control Methods for Electrodeposited Cu Microstructure and Geometry - Applications in the Cu Foil Manufacture,Cu Microvias Filling and Cu/Sn Joints
博士 === 國立中興大學 === 化學工程學系所 === 105 === The microstructure and deposition geometry of electrodeposited Cu are controlled by tuning the chemical parameters (e.g., the concentration of plating additives and the pH value of the plating solution) and the physical parameters (e.g., the convection of the pl...
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| Format: | Others |
| Language: | en_US |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36846060712699672631 |