| Summary: | 碩士 === 明新科技大學 === 電機工程系碩士班 === 105 === In today's highly competitive semiconductor industry, launch a product is also very fast, in the case of limited productivity how to improve production technology and high yield rate, reduce the production process of the abnormal losses are every semiconductor factory has been pursuing the target, so does in the packaging industry. Launch a product on package test field for the product can be introduced as soon as possible to market slave have an absolute relationship.In the case of more and more products have to test, an increasing number of products need to test, in the current test machine the complete test of the station cannot fully exploit the benefits of the test equipment, and also cannot test multiple data at the same time, therefore, this research draws up to improve operating procedures，Single-station test production schedule integration into multi-station tests,use Pipeline architecture and through the Socket network transmission to ensure that the data can be properly synchronized to collect so it must modify the test machine control process to solve the synchronization problem arising from data aggregation.This research mentions the Pipeline architecture improve the testing process，can effectively improve the IC test time（Increase by about 70%）. From this we can know that this process can improve the testing process, certainty can Semiconductor IC test industry improve test launch a product
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