Junction Depth and Anode Width Correlated with Switch Function of IGBT and Fitting Analysis Correlated with Different Channel Length

碩士 === 明新科技大學 === 電子工程系碩士班 === 105 === Insulated Gate Bipolar Transistor (IGBT) is a power discrete with both benefits; one of them is high input impedance of MOSFET and the other is high current gain of BJT (Bipolar Junction Transistor). Successfully associated with the merits of high input impedan...

Full description

Bibliographic Details
Main Authors: Yang,Chong Wei, 楊崇偉
Other Authors: Hsin-Chia Yang
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/dk4uzc
id ndltd-TW-105MHIT0686007
record_format oai_dc
spelling ndltd-TW-105MHIT06860072019-05-15T23:24:49Z http://ndltd.ncl.edu.tw/handle/dk4uzc Junction Depth and Anode Width Correlated with Switch Function of IGBT and Fitting Analysis Correlated with Different Channel Length 接面深度與陽極寬度對開關IGBT元件相關性及不同通道長度考量下N型鰭式場效電晶體電性數據分析 Yang,Chong Wei 楊崇偉 碩士 明新科技大學 電子工程系碩士班 105 Insulated Gate Bipolar Transistor (IGBT) is a power discrete with both benefits; one of them is high input impedance of MOSFET and the other is high current gain of BJT (Bipolar Junction Transistor). Successfully associated with the merits of high input impedance gate-controlling MOSFET and internal driven high current gain of Bipolar, Insulated Gate Bipolar Transistor (IGBT) performs well on controlling high power convey. IGBT may also work in the circumstance with the high reversed bias, which is quite impressive. However, to test the electrical performances, it might not be definitely due to the use of extremely high power tester. Authors thus expect to explore certain process-related or structure related properties of fabricated IGBT using Agilent 4156C. With the fixed gate bias (5V) and the uniform threshold voltage (identified to be 4.1V), the VDS raise at the constant current increase is proposed to understand the influence subjected to the corresponding various process conditions and pre-designed lengths of source and gate. FinFET devices are fabricated on SOI wafer (Silicon on Insulator) with 3-D fin-like body wrapped with poly-silicon as gate electrode. The whole body is easily depleted as applied with a bias on gate. The depleted region, of course, may demonstrate high resistive path reducing and lowering the leakage current even if the channel length is shortened. In thesis, there are three devices with two kinds of channel lengths, 100nm and 500nm. Those devices are put to measurements and the current-voltage data are therefore figured and compared with the basic conventional formula. For one thing, ID-VG characteristic curves may show turn-off leakage current addressing Drain Induced Barrier Lowering (DIBL) and Punch-through issues. On the other hand, ID-VD characteristic curves are fitted with the conventional formula to abstract the threshold voltages, which are used to analyze the electric performance and the implicit or underlying physics. The fitting is done by introducing the deviation which is defined to be the summation of the square of subtraction of the fitting values from the measured values. As the deviation reaches the minimum, the fitting is supposed to be as successful as possible. Hsin-Chia Yang 楊信佳 2017 學位論文 ; thesis 53 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 明新科技大學 === 電子工程系碩士班 === 105 === Insulated Gate Bipolar Transistor (IGBT) is a power discrete with both benefits; one of them is high input impedance of MOSFET and the other is high current gain of BJT (Bipolar Junction Transistor). Successfully associated with the merits of high input impedance gate-controlling MOSFET and internal driven high current gain of Bipolar, Insulated Gate Bipolar Transistor (IGBT) performs well on controlling high power convey. IGBT may also work in the circumstance with the high reversed bias, which is quite impressive. However, to test the electrical performances, it might not be definitely due to the use of extremely high power tester. Authors thus expect to explore certain process-related or structure related properties of fabricated IGBT using Agilent 4156C. With the fixed gate bias (5V) and the uniform threshold voltage (identified to be 4.1V), the VDS raise at the constant current increase is proposed to understand the influence subjected to the corresponding various process conditions and pre-designed lengths of source and gate. FinFET devices are fabricated on SOI wafer (Silicon on Insulator) with 3-D fin-like body wrapped with poly-silicon as gate electrode. The whole body is easily depleted as applied with a bias on gate. The depleted region, of course, may demonstrate high resistive path reducing and lowering the leakage current even if the channel length is shortened. In thesis, there are three devices with two kinds of channel lengths, 100nm and 500nm. Those devices are put to measurements and the current-voltage data are therefore figured and compared with the basic conventional formula. For one thing, ID-VG characteristic curves may show turn-off leakage current addressing Drain Induced Barrier Lowering (DIBL) and Punch-through issues. On the other hand, ID-VD characteristic curves are fitted with the conventional formula to abstract the threshold voltages, which are used to analyze the electric performance and the implicit or underlying physics. The fitting is done by introducing the deviation which is defined to be the summation of the square of subtraction of the fitting values from the measured values. As the deviation reaches the minimum, the fitting is supposed to be as successful as possible.
author2 Hsin-Chia Yang
author_facet Hsin-Chia Yang
Yang,Chong Wei
楊崇偉
author Yang,Chong Wei
楊崇偉
spellingShingle Yang,Chong Wei
楊崇偉
Junction Depth and Anode Width Correlated with Switch Function of IGBT and Fitting Analysis Correlated with Different Channel Length
author_sort Yang,Chong Wei
title Junction Depth and Anode Width Correlated with Switch Function of IGBT and Fitting Analysis Correlated with Different Channel Length
title_short Junction Depth and Anode Width Correlated with Switch Function of IGBT and Fitting Analysis Correlated with Different Channel Length
title_full Junction Depth and Anode Width Correlated with Switch Function of IGBT and Fitting Analysis Correlated with Different Channel Length
title_fullStr Junction Depth and Anode Width Correlated with Switch Function of IGBT and Fitting Analysis Correlated with Different Channel Length
title_full_unstemmed Junction Depth and Anode Width Correlated with Switch Function of IGBT and Fitting Analysis Correlated with Different Channel Length
title_sort junction depth and anode width correlated with switch function of igbt and fitting analysis correlated with different channel length
publishDate 2017
url http://ndltd.ncl.edu.tw/handle/dk4uzc
work_keys_str_mv AT yangchongwei junctiondepthandanodewidthcorrelatedwithswitchfunctionofigbtandfittinganalysiscorrelatedwithdifferentchannellength
AT yángchóngwěi junctiondepthandanodewidthcorrelatedwithswitchfunctionofigbtandfittinganalysiscorrelatedwithdifferentchannellength
AT yangchongwei jiēmiànshēndùyǔyángjíkuāndùduìkāiguānigbtyuánjiànxiāngguānxìngjíbùtóngtōngdàozhǎngdùkǎoliàngxiànxíngqíshìchǎngxiàodiànjīngtǐdiànxìngshùjùfēnxī
AT yángchóngwěi jiēmiànshēndùyǔyángjíkuāndùduìkāiguānigbtyuánjiànxiāngguānxìngjíbùtóngtōngdàozhǎngdùkǎoliàngxiànxíngqíshìchǎngxiàodiànjīngtǐdiànxìngshùjùfēnxī
_version_ 1719146444404817920