Applying of 3D In-mold Decoration Technology on Forming a Film with Conductive Circuits

• Main Authors: LI, JI-HUAN, 李季桓
• Other Authors: WU, CHENG-HSIEN
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/38320528526823451543

碩士 === 國立高雄應用科技大學 === 模具工程系 === 105 === IMD (In-Mold Decoration) in mold decoration for the pattern structure of plastic product in the injection molding filling in and melt together forming, simplifying the machining process, and meet the needs of mass production with the molding technology in mold decoration, IMD technology is divided into three main categories, namely, IMR (In-Mold, Roller), IML (In-Mold, Label), IMF (In-Mold, Forming). IMF process products are subject to the influence of shape, mold design and forming parameters, and produce rupture, wrinkles or stress concentration, resulting in poor appearance, the traditional mold decoration can be applied only in the plane or moderate, if the curvature is large, easily lead to rupture and wrinkle, so the study in film printing, thermoforming and injection molding design, product testing, planning and design a series of experiments. and the design of acute angle, obtuse angle, concave arc, convex arc, straight line in round shape and angle shaped two types of products, to observe the shape of the thermoforming and injection molding quality change process, combined with the printed circuit technology, development the diversity of IMF applications. In this study, the three-dimensional process of film, using gas-assisted thermoforming technology, and three methods of forming without pre drawing, pre drawing and local heating respectively, the results show that the effect of local heating is best, the average thickness of rounded film is reduced by about 4.27%, the most serious position is concave arc, the stress concentration is completely disappeared when the mold temperature is 165 °. Injection molding, set four factors, A mold temperature, B plastic temperature, C injection speed and D packing press, through the Taguchi method, the best parameters of the injection molding are rounded A2B3C1D1, beveled A2B2C2D2, and the parameters with the highest contribution rate are packing pressure. With conductive circuits IMF finished only the use of local heating hot pressing method can be successfully formed, and the resistance in the process after forming the measurement values are the same.