Experimental and Optimization Analysis of the Cantilever Probe
碩士 === 國立高雄應用科技大學 === 模具工程系 === 105 === Before the chip sliced,using the wafer probe to contact the bumps is to test whether its electrical properties is normal or not. If there is an inappropriate overdrive in the process,it will remain overmuch scratch , reduce the yield of the chip so that brings...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16148652185095074575 |