| Summary: | 碩士 === 國立高雄應用科技大學 === 模具工程系 === 105 === Before the chip sliced,using the wafer probe to contact the bumps is to test whether its electrical properties is normal or not. If there is an inappropriate overdrive in the process,it will remain overmuch scratch , reduce the yield of the chip so that brings on increasing cost of manufacture.Above the synthesis states, it will affect the life of the probe.In the study,conducting fatigue test by the Cantilever Probe.In addition,taking advantage of the Taguchi method to bring up its optimization fatigue life and dimensions.
The study utilizes the fatigue prober which Overdrive(OD) is 75μm.Measured in probing number is 0k,1k,5k,10k,30k,50k,100k,300k,500k,750k,1000,1250k,1500k and 1750k times, the shape of the probe,the displacement of the needle tip and reaction force of the probe.In the study,the probe material adopted is rhenium tungsten.Next, using the Taguchi method to analyze the magnitudes of the probe fatigue life ,the testing conditions are: the probe geometry sizes will be changed ,including the bending angle,the length of the needle tip and the shooting angle.It is expected that the probe can obtain the optimization fatigue life and the probe geometry sizes.Thirdly, we analysis the results of Taguchi method, reparation of the original and optimization probe,can greatly bring up the probe fatigue life .Finally,integration results established the relationship between the related probe of the equation.
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