| Summary: | 碩士 === 國立高雄應用科技大學 === 機械工程系 === 105 === In this study, the multi-scale method was used to simulate the contact effect between nickel and copper. The results show that the contact depth has a significant effect on the contact stress, and the [-110][111] direction has the highest contact stress. The results of the lap effect show that there is a high contact stress when the lap length is 2.5 nm. However, unlike the result of the jointing effect, the directionality has little effect on the lap stress. Finally, in small-size joints, the contact depth has a significant effect on the contact stress, whereas the directional effect is different from the large size because the effect on the scale makes the directivity effect not significant.The results of the final molecular dynamics simulation show that the nanowires are stretched in the best direction [-110][111] is quite close to the multiscale method, and the results of the bonding are quite close to the properties of the material itself. However, the results of the [110][001] and [111][-110] directional multi-scale methods differ greatly from those of the molecular dynamics, because of the very serious strain at the bottom of the substrate during the multi-scale bonding process Region, this phenomenon caused by the bonding process in the fall delay and stress rise. Therefore, the final results show that the direction of the material in the nanowire bonding is critical, and the optimum depth of the joint needs to be tested. At the same time the general nanowires in the substrate contact effect also has a very significant impact, which must be considered in the experiment.
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