Study on Drawing of Wire Rod Using Rotating Die under Coulomb Friction

碩士 === 國立高雄應用科技大學 === 機械工程系 === 105 === This study aims at the drawing process of wire rod using the rotating die assuming Coulomb friction to establish the analysis models based on the slab method and finite element method. The slab method can construct the theoretical analysis model to obtain vari...

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Bibliographic Details
Main Authors: HSU,HUNG-YING, 徐宏穎
Other Authors: HSU,CHAO-MING
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/02709785601254285583
Description
Summary:碩士 === 國立高雄應用科技大學 === 機械工程系 === 105 === This study aims at the drawing process of wire rod using the rotating die assuming Coulomb friction to establish the analysis models based on the slab method and finite element method. The slab method can construct the theoretical analysis model to obtain various stress distributions, compression force, and rotating torque. However, the finite element method uses the DEFORM-3D commercial software to carry out the simulation analysis. Constant frictional coefficient is assumed at the interface between die and wire rod to explore different drawing conditions such as rotating angular velocity (ω), half die angle (α°), frictional coefficient (), die filet (R) on the influence of drawing forming characteristics. The axial stress, the radial stress, the drawing force, and the rotating moment can be obtained from the slab method. Comparing with the drawing force of FEM, the average error is around 14% to realize the acceptance and variation for both models. Increasing the rotating effect of die or the die filet is to reduce the drawing force and increase the flowing of wire rod. It is worthy to remind that the optimum half die angle and the lowest drawing force can be obtained in this study. The optimum half die angle and the lowest drawing force are decreased with the rotating angular velocity. The research results can provide to the industries as the references of establishment of rotating forming technology