Improve Performance of Wafer Tester With Time Domain Reflectometry

• Main Authors: Tsai, Meng-Hsuan, 蔡孟軒
• Other Authors: Chen, Tsong-Yi
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/s5yas4

碩士 === 國立高雄應用科技大學 === 電子工程系 === 105 === Many years ago, product testing just accounted for a fraction of the cost of semiconductor manufacturing. To the present, the cost of product testing has accounted for the most of semiconductor manufacturing. The most important goal is to improve production capacity in the testing economic view. The cost of product testing = The costs per second × Testing time. To reduce testing time, to increase the testing yield, and to increase production capacity is to increase the income of the important factors. It happens continue fail in the test process inevitably. Maintenance man has to suspend the machine and repair it. The length of the repair time also affects the testing time. Lengthening the testing time is increasing the testing costs. There is a problem with overkill in testing, especially O/S( Open/Short), where the occurrence of O/S in the entire path that is the tester to the end of the probe card. We couldn’t identify at the first time in the part so we must find the root cause from the end of the probe card to the tester. We need to do inspection and exclusion step by step. That is wasted time and labor. The study will introduce “Time Domain Reflectometry” (TDR) to be a check tool for maintenance. We could learn where O/S occurs in the entire path to reduce maintenance time that we also reduce the cost of the testing. The results are confirmed an increase in production capacity of 0.9% performance and save cost of the testing about NT. 220,000 per a month. We can know that poor vacuum brings bad contact using TDR tool checking. I create the Vacuum Gauge to check vacuum pressure that its’ spec is -20 inHg ~ -30 inHg. I add the item that is Vacuum Gauge checking in the SOP of calibration.