Investigation of bilayer resin-bonded fixed abrasive wires using the pultrusion process
博士 === 華梵大學 === 機電工程學系 === 105 === Fixed abrasive wire saws have been widely used to cut the hard brittle materials in the industry of solar and semiconductor to have many advantages such as a small kerf loss, high efficiency, environmental protection, low cost, etc. The resin-based fixed abrasive...
Main Authors: | LIU, YI-HSIEN, 劉懿賢 |
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Other Authors: | 羅勝益 |
Format: | Others |
Language: | zh-TW |
Published: |
2017
|
Online Access: | http://ndltd.ncl.edu.tw/handle/09184032208043965044 |
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