Investigation of bilayer resin-bonded fixed abrasive wires using the pultrusion process

博士 === 華梵大學 === 機電工程學系 === 105 === Fixed abrasive wire saws have been widely used to cut the hard brittle materials in the industry of solar and semiconductor to have many advantages such as a small kerf loss, high efficiency, environmental protection, low cost, etc. The resin-based fixed abrasive...

Full description

Bibliographic Details
Main Authors: LIU, YI-HSIEN, 劉懿賢
Other Authors: 羅勝益
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/09184032208043965044
id ndltd-TW-105HCHT0657004
record_format oai_dc
spelling ndltd-TW-105HCHT06570042017-09-09T04:34:30Z http://ndltd.ncl.edu.tw/handle/09184032208043965044 Investigation of bilayer resin-bonded fixed abrasive wires using the pultrusion process 拉擠成型製造雙層樹脂基固定磨粒線之研究 LIU, YI-HSIEN 劉懿賢 博士 華梵大學 機電工程學系 105 Fixed abrasive wire saws have been widely used to cut the hard brittle materials in the industry of solar and semiconductor to have many advantages such as a small kerf loss, high efficiency, environmental protection, low cost, etc. The resin-based fixed abrasive wire saws, compared with the electroplated fixed abrasive wire saws, have lower cost, the relatively simple process, the high production rate, the smaller edge chipping and the better surface roughness, but the lower service life and the slower cutting efficiency. Hence, the resin-based fixed abrasive wires are investigated to fabricate with a significant research value. Wire pultrusion was achieved to fabricate the resin bonded abrasive composite materials with constant cross-section whereby piano wire of diameter 120 μm used as a core was pulled through a surface pretreatment, resin bath and into a die orifice and oven, where the impregnated resin slurry cured under a moderate temperature. The bilayer resin-bonded fixed diamond wire diameter of about 191-205 μm with an inner layer of phenolic modified epoxy resin and 50 vol% alumina and an outer layer of phenolic resin and 10-30 vol% diamond grid through pultrusion method was presented. The results showed that when liquid resin slurry containing a larger diamond concentration during pultrusion process was used, the resulting larger wire diameter, less diamond spacing, and higher diamond protrusion were obtained. Besides, the resistance of resin layer pulled-out in bending, impact, the resistance of fatigue fracture in wire winding, the resistance of twist fracture of wire obtained for bilayer resin-bonded fixed diamond wire with the increase of diamond concentration produced the better ability. When the bilayer resin-bonded fixed diamond contained the diamond grit of 25 vol%, the resulting these properties showed a relatively better condition. 羅勝益 2017 學位論文 ; thesis 103 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 博士 === 華梵大學 === 機電工程學系 === 105 === Fixed abrasive wire saws have been widely used to cut the hard brittle materials in the industry of solar and semiconductor to have many advantages such as a small kerf loss, high efficiency, environmental protection, low cost, etc. The resin-based fixed abrasive wire saws, compared with the electroplated fixed abrasive wire saws, have lower cost, the relatively simple process, the high production rate, the smaller edge chipping and the better surface roughness, but the lower service life and the slower cutting efficiency. Hence, the resin-based fixed abrasive wires are investigated to fabricate with a significant research value. Wire pultrusion was achieved to fabricate the resin bonded abrasive composite materials with constant cross-section whereby piano wire of diameter 120 μm used as a core was pulled through a surface pretreatment, resin bath and into a die orifice and oven, where the impregnated resin slurry cured under a moderate temperature. The bilayer resin-bonded fixed diamond wire diameter of about 191-205 μm with an inner layer of phenolic modified epoxy resin and 50 vol% alumina and an outer layer of phenolic resin and 10-30 vol% diamond grid through pultrusion method was presented. The results showed that when liquid resin slurry containing a larger diamond concentration during pultrusion process was used, the resulting larger wire diameter, less diamond spacing, and higher diamond protrusion were obtained. Besides, the resistance of resin layer pulled-out in bending, impact, the resistance of fatigue fracture in wire winding, the resistance of twist fracture of wire obtained for bilayer resin-bonded fixed diamond wire with the increase of diamond concentration produced the better ability. When the bilayer resin-bonded fixed diamond contained the diamond grit of 25 vol%, the resulting these properties showed a relatively better condition.
author2 羅勝益
author_facet 羅勝益
LIU, YI-HSIEN
劉懿賢
author LIU, YI-HSIEN
劉懿賢
spellingShingle LIU, YI-HSIEN
劉懿賢
Investigation of bilayer resin-bonded fixed abrasive wires using the pultrusion process
author_sort LIU, YI-HSIEN
title Investigation of bilayer resin-bonded fixed abrasive wires using the pultrusion process
title_short Investigation of bilayer resin-bonded fixed abrasive wires using the pultrusion process
title_full Investigation of bilayer resin-bonded fixed abrasive wires using the pultrusion process
title_fullStr Investigation of bilayer resin-bonded fixed abrasive wires using the pultrusion process
title_full_unstemmed Investigation of bilayer resin-bonded fixed abrasive wires using the pultrusion process
title_sort investigation of bilayer resin-bonded fixed abrasive wires using the pultrusion process
publishDate 2017
url http://ndltd.ncl.edu.tw/handle/09184032208043965044
work_keys_str_mv AT liuyihsien investigationofbilayerresinbondedfixedabrasivewiresusingthepultrusionprocess
AT liúyìxián investigationofbilayerresinbondedfixedabrasivewiresusingthepultrusionprocess
AT liuyihsien lājǐchéngxíngzhìzàoshuāngcéngshùzhījīgùdìngmólìxiànzhīyánjiū
AT liúyìxián lājǐchéngxíngzhìzàoshuāngcéngshùzhījīgùdìngmólìxiànzhīyánjiū
_version_ 1718532098926575616