| Summary: | 博士 === 華梵大學 === 機電工程學系 === 105 === Fixed abrasive wire saws have been widely used to cut the hard brittle materials in the industry of solar and semiconductor to have many advantages such as a small kerf loss, high efficiency, environmental protection, low cost, etc. The resin-based fixed abrasive wire saws, compared with the electroplated fixed abrasive wire saws, have lower cost, the relatively simple process, the high production rate, the smaller edge chipping and the better surface roughness, but the lower service life and the slower cutting efficiency. Hence, the resin-based fixed abrasive wires are investigated to fabricate with a significant research value.
Wire pultrusion was achieved to fabricate the resin bonded abrasive composite materials with constant cross-section whereby piano wire of diameter 120 μm used as a core was pulled through a surface pretreatment, resin bath and into a die orifice and oven, where the impregnated resin slurry cured under a moderate temperature. The bilayer resin-bonded fixed diamond wire diameter of about 191-205 μm with an inner layer of phenolic modified epoxy resin and 50 vol% alumina and an outer layer of phenolic resin and 10-30 vol% diamond grid through pultrusion method was presented. The results showed that when liquid resin slurry containing a larger diamond concentration during pultrusion process was used, the resulting larger wire diameter, less diamond spacing, and higher diamond protrusion were obtained. Besides, the resistance of resin layer pulled-out in bending, impact, the resistance of fatigue fracture in wire winding, the resistance of twist fracture of wire obtained for bilayer resin-bonded fixed diamond wire with the increase of diamond concentration produced the better ability. When the bilayer resin-bonded fixed diamond contained the diamond grit of 25 vol%, the resulting these properties showed a relatively better condition.
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