The Assembly and Alignments for Dicing Saws
碩士 === 逢甲大學 === 智能化機電系統設計產業碩士專班 === 105 === There are two cutting methods of wafer which are blade cutting and laser cutting. This study begins with blade cutting, and then using the dicing saws which able to cut the 6-inch wafer as the study base. In the end of the experiment, we can get a complete...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25388933905898450388 |
| Summary: | 碩士 === 逢甲大學 === 智能化機電系統設計產業碩士專班 === 105 === There are two cutting methods of wafer which are blade cutting and laser cutting. This study begins with blade cutting, and then using the dicing saws which able to cut the 6-inch wafer as the study base. In the end of the experiment, we can get a complete wafer dicing saws from nothing.
The study focused on assembly of machine and calibration. Realizing the basic principle are assembly and alignments first, then apply the principle of assembly to study machine components classification and the tuning method. The way of building the machine、torque value on the fix bolts、alignment method and steps are all be needed to know as well. In order to create smooth assembly process, stacking method and component modularization are used on the planning steps. The study can establish machine’s modularization and the right assembly procedure. It not only can improve the assembly process but also can reduce the assembly time, and increase the production capacity.
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