Thermal Displacement Analysis and Tolerance Prediction of Mold Slide Structure

• Main Authors: LIN,JIA-HE, 林佳和
• Other Authors: WANG,CHI-CHANG
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/99820285647615527589

碩士 === 逢甲大學 === 機械與電腦輔助工程學系 === 105 === In the development of precise molds, consider the accuracy of products and mold motion. The mold reservation tolerance calculation is important part. In this research, the finite element software ANSYS is used to analysis the temperature distribution and displacement of the mold slide parts during the injection molding process. The steady-state simulation results indicate that the slide in the injection process, each parts will interfere with each other because of their displacement. Discuss stresses will be subjected to the process, the thermal stress becomes greater impact of displacement. Therefore, improve the displacement from the aspect of temperature. Change the water temperature and waterway location can effectively improve the interference value. And then discuss the structure with transient-state analysis, which more close to the reality of the production. The overall temperature data distribution is lower than steady-state, and so is the displacement value. However, due to the transient-state analysis is more complex than the steady-state. In this paper, propose an approach by using the curve fitting method replace the transient-state analysis data with the steady-state analysis data to reduce the analysis setup and the solution time.