| Summary: | 碩士 === 逢甲大學 === 經營管理碩士在職學位學程 === 106 === The semiconductor industry is very competitive, and the cost and fast delivery are becoming more important; especially for the packaging and testing industries of the semiconductor supply chain. This research focuses on the final packaging and testing of memory cards and electronic components ICs for semiconductor manufacturing processes. The purpose of this research is to find the main production characteristics, which includes order-based foundry service, packaging process, test process, Wafer and Wafer operations and other characteristics.
To understand how the industry needs to use the regular original Wafer in a highly competitive market. The process and the Wafer grain process apportion the risk to enhance the company's operations and improve the lack of single crisis.
The smooth process of product introduction will affect the company's profits and growth. How to use the information by internal information systems to meet the customer's production needs, and to plan a reasonable, accurate, simple, rapid, quality-oriented planning mass production is a very important issue.
For the purpose of this study, there are few semiconductor Wafer suppliers, and the supply is less than the demand leads to the limited production capacity. Currently, the main module and the memory card manufacturer mutually place a Wafer. Through the needs of these manufacturers, people can understand the Wafer industry and correctly perform Wafer cutting and Wafer grain selection and testing to achieve the requirements of cost reduction and quality control correctly and effectively.
In the global economy competition, the rapid reaction production mode of the industry can have the production advantages and cost advantages to meet the customer’s needs , reach mass production speed with better quality, and maintain competitive advantages.
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