An application of Taguchi method to improve the first solder joint of copper process
碩士 === 逢甲大學 === 工業工程與系統管理學系 === 105 === In the semiconductor IC packaging process, the wire bonding process technology has been developed for a long time and the reliability is higher than that of other bonding processes in this thesis, we investigate and optimize the parameters setting of TFBGA (Th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93013614967280275475 |