Analysis of mechanical properties and deformation mechanism of multilayered Au/Cu films using molecular dynamics simulations

• Main Authors: Wen-Xiang Jiang, 江文翔
• Other Authors: Cheng-Da Wu
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/cgi-bin/gs32/gsweb.cgi/login?o=dnclcdr&s=id=%22105CYCU5489065%22.&searchmode=basic

碩士 === 中原大學 === 機械工程研究所 === 105 === In this study, the mechanical properties of nano-multilayer Au/Cu are investigated by molecular dynamics. This article divided into three parts: tension, compression, and indentation. The multilayers, speed, and temperature effects are investigated. In addition, the structure deformations are examined. The result show that strength and yielding of material increasing with increasing the number of layers in tension experiment. For the tensile speed effect, a higher tensile speed suppresses the formation of dislocation for releasing the stress. The temperature effect shows that the energy increases with increasing temperature. The model of structure is present by other structure. The proportion of other structure is more than HCP and FCC structure; Next, The compression simulation tests show that increase of layer number can release the stress from model. The compression speed effect show that the defect is rapidly accumulated, causing it cannot release the stress to fast in the model and the model will be fast cracked; Finally, indentation simulation tests find that the model with Cu surface has a higher hardness than that Au with surface. The speed effect show that the other structure is higher rate when the indentation has been indented with high speed. We also find out the dislocation is decreased when the other structure is increased. The temperature effect show that the model’s hardness can’t be changed by temperature.