The accompanied effects of process-oriented and temperature cycling loadings on the warpage of thin-type 3D-ICs packaging structure and the creep behavior of microjoints
碩士 === 中原大學 === 機械工程研究所 === 105 === Owing to the fact that requirements of the lifestyle for electronis devices has been shifted to a stage physically small and thin, a high density of chips is designed to meet the foregoing demand under the limited space. Although the technology of 2D-ICs packaging...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45262807612088466725 |