| Summary: | 碩士 === 中原大學 === 工業與系統工程研究所 === 105 === Through the improvement of science and technology industry, the demand of IC increases and effects the whole semi-conductor process lane. The design of IC has become more and more diversification and the packing technic has also improved since the great compete between IC testing and packing company, decrease the due date and increase process rate is an important task.
This research investigate on order scheduling and parallel machine assignment problem in single factory, in semiconductor wafer packing process, the out decide the usage of the bottleneck wiring and what effects the usage is the frequency of changing machine progress, once the frequency more often, the less its able to process and effect the output. This research focuses on wiring as target to find the best input order in order to decrease the frequency to the maximum machine usage.
What we consider : scheduling and parallel-machine assignment is a NP-hard problem, first we propose mathematical model of mixed integer programming using auto transform order information into what is needed and use genetic algorithm in Matlab to solve, once we get similar optimal solution, the optimal program will automatically calculate the daily usage from wafer milling to wiring. This makes the consultation of the order of arranging.
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