| Summary: | 碩士 === 中華大學 === 電機工程學系 === 105 === 60GHz commercial power amplifier or low noise amplifier currently available on the market are mostly in bare DIE form rather than in IC package. This type of IC is more difficult for mmWave system integration.
This thesis was focused on three different interconnection methods including Wire Bonding, Flip-Chip and Ribbon Bonding for DIE to PCB. We also design the matching circuit for amplifier system optimization and propose a cheaper system integration structure to ensure that IC in mmWave frequency characteristics and performance are improved.
Keywords:60GHz,power amplifier,low noise amplifier,DIE,Interconnection,Wire Bonding,Flip-Chip,Ribbon Bonding,matching circuit.
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