On the Improvement of LED Performance by Chip Process and Package Technology
博士 === 長庚大學 === 電子工程學系 === 105 === (1) The first part of this thesis involves immersing AlGaInP LED in (NH4)2Sx solution to carry out the surface sulfur treatment, hoping that such sulfur treatment could passivate LED surface, remove dangling bond and eliminate surface damages resulted during the wa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4g4sdz |