A study on interfacial reactions in lead-free solder joints-using co-deposited Co(P) and Co(Zn) as diffusion barrier
碩士 === 國立中正大學 === 化學工程研究所 === 105 === Co system is the most promising diffusion barrier on the electronic package, but the interfacial reaction between Co and Sn was extremely fast, which led to the massive Sn-Co IMC growth, so that the reliability of the solder joint is reduced. In our past studies...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/58371526988694472883 |