Mechanism of Microvoid Formation and Their Prevention in Micro-scale Joints
碩士 === 元智大學 === 化學工程與材料科學學系 === 104 === In recent years, as electronic products tend to lighter and higher performance, the development of the size in transistors becomes more difficult. In order to offers a much greater vertical interconnect density, 3D IC (three-dimensional integrated circuits) is...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/14697506059305099229 |