The case study of IC carrier electroless Ni/Pd/Au process quality improvement
碩士 === 元智大學 === 化學工程與材料科學學系 === 104 === In this study, add KCN dipping treatment and make CN- reacts with Pd ion residue on IC substrate copper line build up by SAP method. Finally we find KCN dipping treatment can effectively improve the issue that electroless Ni/Pd/Au layer depositing on core or p...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52426295216215896345 |
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