The effects of surfactants on the electroless nickel plating process and coating’s mechanical properties in the blind hole metallization of PCB
碩士 === 國立臺北科技大學 === 製造科技研究所 === 104 === Printed circuit board (PCB) with multi-layered circuit configuration has become an important technical practice in applications. The via between circuit layers play a key component role for the integration of the circuits. For further compaction of the circuit...
Main Authors: | Chen-Hsin Yao, 姚承鑫 |
---|---|
Other Authors: | Chun-Ying Lee |
Format: | Others |
Language: | zh-TW |
Published: |
2016
|
Online Access: | http://ndltd.ncl.edu.tw/handle/qjrsty |
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