| Summary: | 碩士 === 國立臺北科技大學 === 化學工程研究所 === 104 === In this work, we have developed a novel transparent flexible organic-inorganic hybrid encapsulation barrier consisting of polymer/metal oxide hybrid for efficient protection of flexible electronic devices. The organic polymer and the inorganic amorphous metal oxide layers were deposited alternatingly on polyethylene terephthalate (PET) substrate by using chemical vapor deposition (CVD) and reactive direct current (DC) magnetron sputtering techniques, respectively. The deposition of polymer films consists of two steps. In the first step, the dimer is cleaved into two monomer units through vacuum pyrolysis at temperature of 650°C and chamber pressure of < 30 mTorr. In the next step, these monomers were spontaneously polymerized as polymer onto the PET substrate at room temperature. The inorganic amorphous layers were prepared through DC magnetron sputtering with metal alloys target under Ar/O2 atmosphere conditions. The coating parameters such as, DC power, O2 contents in Ar atmosphere and deposition time were studied and optimized in order to get maximal performance. The water vapor transmission rate (WVTR), film thickness, index of refraction, light transmittance and microstructure of each organic and inorganic films were measured. The prepared encapsulation barriers containing five hybrid layers exhibited WVTR of 5.0×10-5 g/m2 day at 37.8°C under ambient atmospheric conditions. The much lower water and oxygen permeability and high mechanical flexibility of the organic/metal oxide hybrid barriers reveal their great promise in thin-film encapsulation technology.
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