| Summary: | 碩士 === 國立臺北科技大學 === 工業工程與管理系碩士班 === 104 === The printed circuit board assembly (PCBA) process has evolved from through hole technology to surface mount technology (SMT). SMT process effectively enhance the product functional density. Majority of process defects are relate to stencil printing and reflow soldering, for example, inappropriate stencil design and/or excessive printing velocity may result in insufficient solder volume. Instead of identifying root causes, the manufacturer usually make fine tune adjustment when encountering process issues. Thus, the improvement is limited. This study establishes a systematic approach for process innovation. It helps to resolve the process issues and ensure long term competitiveness. In this research, the function analysis is used to point out all the problematic pointes. The cause-effect-contradiction-chain analysis helps identify the key problematic point. The contradiction matrix is employed to suggest trigger solution. This study also proposes a three-dimensional evolution model considering routes to solve manufacturing problem, including man, machine, material, methods, environment and measurement. As a result, we propose the use of Rib Protrusions roller stencil printing technique as well as the mixture of Graphene and Photopolymer to replace solder particles and flux, respectively. This helps to prevent the void formation in solder joint and defects such as tomb-stoning, solder short and open scenarios.
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