Study of The Adhesion of Photo-resist in Bumping Process
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 104 === This thesis focus on the study of the issue of under cut in positive photo resist in lithography process. The under cut of the solder mask may cause the etching of the copper layer underneath the photo-resist and derive failure mode in electric...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45285359558704149552 |