| Summary: | 碩士 === 國立高雄大學 === 電機工程學系-工業技術整合產業研發碩士專班 === 104 === With advances in technology, the chip size is also emphasis on light, thin, short, small, integrated circuit layout and the circuit board toward intensive design. How in the limited conditions of reduced die size, is the most urgent problem to be solved. For optimal circuit board layout packaging factory, so far it is still the design engineer through past experience, but for budding engineers can not effectively substrate size optimization.
In this study, through regression analysis of the original release of the substrate to be reduced in size to optimize the design. The parameters of die attach material, trace rule, copper rule via rule and ball rule prompted the substrate can be more miniaturized. The study concluded that regression analysis can be used as the substrate size to optimize the solution.
|
|---|
