Non-destructive Fault Localization Failure Analysis for Advanced Electronic Packages

• Main Authors: Tseng-Pei-yu, 曾佩玉
• Other Authors: Ming-chang-shi
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/18980905685575001397

碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 104 === As advanced IC package substrate become more complex with multilayer structure, thus using traditional analysis of non-destructive testing methods such as x-ray, ultrasound scanning and detection technology are not applicable. This thesis will explore the use of the time domain reflectometry analysis technique (TDR), and using baseboard loop transmission characteristics of electromagnetic waves to detect the reflected signals in a 2.5D IC package substrates with different layers of the stack frame and effectively detect the location of failure point. In this thesis a defect point was created in 2.5D IC multi-layer package substrate using a laser cutting tool. By time domain reflectometry measurements for reflection time, using dielectric constant of the substrate as given to calculate the failure location of the defected point. As a result, a defected point can be detected by this method within accuracy of 0.86mm. In principle, the accuracy of failure detection can be improved by increasing the time resolution in TDR measurement, and to enhance the effectiveness of packaging failure analysis by this of method.