The Influence of Flatness to The Bonding of Thermoplastic Microfluidic Chips
碩士 === 國立臺灣科技大學 === 機械工程系 === 104 === Warpage is a common problem in the injection molding, rolling printing, and hot embossing of thermoplastic microfluidic chips. Warpage can greatly reduce bond quality and can even lead to chip failure. This study adopted an experimental methodology to investigat...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/30722904159324980824 |