The Study of Laser Cutting to Improve LED Luminous Efficiency and Electrical Yield

• Main Authors: JUN YI LU, 呂俊億
• Other Authors: I-Tseng Tang
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/95434998140721181751

碩士 === 國立臺南大學 === 綠色能源學科技學系碩士在職專班 === 104 === With the global trend of environmental protection, energy conservation, carbon reduction, LED solid state lighting technology because of its small size, high efficiency, long life, safe and reliable, no radiation, no heavy metal pollution-free advantages, and were seen as a new generation of lighting. LED on the cutting process using laser as LED wafer cutting, laser cutting for completely dry process, you do not need to Commission diamond knife round cutting need water or cutting liquid to help cutting and reduced cutting Shi of temperature, also not must faced traditional diamond knife round in cutting Shang will for diamond knife round life effect and collapse angle or produced rubber silk makes products bad, can using mine shot cutting to upgrade units of output, reduced on water resources of waste, reduced cutting consumption products consumption, to reached reduction can reduction carbon of effectiveness.The LED of the Sapphire as a substrate is not easy to cut, in the cutting process will be a lot of problems that cannot be overcome, such as: cutting, chipping, cutting offset ... As well as attenuation resulting in poor efficiency and life of the products. Such as the use of laser cutting to make the LED brightness on the surface without a significant attenuation, cutting required by wet etching of wafer surface by laserSolution integration caused by Splash Guard removal, etching process likely to cause environmental pollution, in the etching process, temperature, time, etching concentration be controlled very precise, but often luminous component damage caused by excessive etching. Femtosecond laser with Ultrashort pulses and optical characteristics of high energy density, and has a special light chemical peel effect of processing small district heating, high machining precision, heat stress, these features to their other half cut effect in lasers. Purpose of this paper to make the LED in the cutting process with extremely high cutting rate, brightness increase and Ir leakage current decrease the use of shorter wavelength 1064 nm pulsed SD (Stealth Dicing) implicit forms of femtosecond laser with wavelength of 355 nm nanosecond laser surface high brightness blue LED on Sapphire substrates (Light-Emitting Diode) cut two different lasers on the small size and large-size LED cut in brightness after cutting grain, grain appearance, grain yield Ir leakage current benefits, and a single and multiple objectives of high quality manufacturing process.