Analysis of Roll-to-Roll Gravure Offset Printing Process for Fine Line Electronic Circuitry
碩士 === 國立清華大學 === 動力機械工程學系 === 104 === Taiwan as a kingdom of semiconductor and electronics technology has attracted the Global attention. The advantages of traditional semiconductor manufacturing process are mass production and high resolution. However, it generally needs expensive equipment and...
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ndltd-TW-104NTHU53111042017-07-30T04:41:27Z http://ndltd.ncl.edu.tw/handle/45124795760050768450 Analysis of Roll-to-Roll Gravure Offset Printing Process for Fine Line Electronic Circuitry 卷軸式凹版轉印精細導線製程分析 Chen,You Wei 陳祐瑋 碩士 國立清華大學 動力機械工程學系 104 Taiwan as a kingdom of semiconductor and electronics technology has attracted the Global attention. The advantages of traditional semiconductor manufacturing process are mass production and high resolution. However, it generally needs expensive equipment and materials and complex procedures. Besides, the electronics circuities of traditional semiconductor were made through the photomask and etching processes. These two processes generally need to use highly acidic chemicals. Thus, it would cause the environmental concerns. Therefore, low-cost, simple, and eco-friendly electronics manufacturing technology would be the target in future development. The roll-to-roll gravure offset printing technology is one of the important choices due to its exceptional advantages, such as continuous mass production, low energy consumption, and fast production. The technology can yield a much lower line height and thinner line width of fine line circuity. Thus, the fine line circuity made from the manufacturing technology can be used as a soft or hard substrate. Because the off and set processes in the roll-to-roll gravure offset printing technology needs the blanket to be a transfer media between the silver paste. The blanket is made of the soft silicon rubber; therefore, it was widely applied for the gravure in the off process, and for the substrate in the set processes. Nevertheless, the silver paste is apt to lose during the transfer process. Thus, it is very essential to pay an attention to improve the yield of roll-to-roll gravure offset printing technology. The thesis aims at applying the experimental measurement to investigating the physical mechanism of the printing process by utilizing the silver paste provided from the Opto-Electronics & Systems Laboratories of ITRI, and several parameters, such as surface tension force of silver paste at different solvent content, contact angle of silver paste deposited on different gravure plates, blankets, and substrates. Then, the universal micro-testing machine was used to explore the transfer ratio during the off and set processes. Their influences of loading rate and temperature were also investigated. In addition, to attain the important parameters on the roll-to-roll gravure offset printing process, some parameters, such as different types of gravure, blanket and substrates, on the off and set processes were further examined. Finally, the Surface Evolver code was also applied to evaluate the transfer ratio during the off and set processes, and the results are compared to those of the experiment. The results in thesis can provide a reference for relevant researchers on adjusting the parameters of roll-to-roll gravure offset printing process. Chen,Wen Hwa Cheng,Hsien Chie 陳文華 鄭仙志 2016 學位論文 ; thesis 70 zh-TW |
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碩士 === 國立清華大學 === 動力機械工程學系 === 104 === Taiwan as a kingdom of semiconductor and electronics technology has attracted the Global attention. The advantages of traditional semiconductor manufacturing process are mass production and high resolution. However, it generally needs expensive equipment and materials and complex procedures. Besides, the electronics circuities of traditional semiconductor were made through the photomask and etching processes. These two processes generally need to use highly acidic chemicals. Thus, it would cause the environmental concerns. Therefore, low-cost, simple, and eco-friendly electronics manufacturing technology would be the target in future development.
The roll-to-roll gravure offset printing technology is one of the important choices due to its exceptional advantages, such as continuous mass production, low energy consumption, and fast production. The technology can yield a much lower line height and thinner line width of fine line circuity. Thus, the fine line circuity made from the manufacturing technology can be used as a soft or hard substrate. Because the off and set processes in the roll-to-roll gravure offset printing technology needs the blanket to be a transfer media between the silver paste. The blanket is made of the soft silicon rubber; therefore, it was widely applied for the gravure in the off process, and for the substrate in the set processes. Nevertheless, the silver paste is apt to lose during the transfer process. Thus, it is very essential to pay an attention to improve the yield of roll-to-roll gravure offset printing technology.
The thesis aims at applying the experimental measurement to investigating the physical mechanism of the printing process by utilizing the silver paste provided from the Opto-Electronics & Systems Laboratories of ITRI, and several parameters, such as surface tension force of silver paste at different solvent content, contact angle of silver paste deposited on different gravure plates, blankets, and substrates.
Then, the universal micro-testing machine was used to explore the transfer ratio during the off and set processes. Their influences of loading rate and temperature were also investigated. In addition, to attain the important parameters on the roll-to-roll gravure offset printing process, some parameters, such as different types of gravure, blanket and substrates, on the off and set processes were further examined. Finally, the Surface Evolver code was also applied to evaluate the transfer ratio during the off and set processes, and the results are compared to those of the experiment.
The results in thesis can provide a reference for relevant researchers on adjusting the parameters of roll-to-roll gravure offset printing process.
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author2 |
Chen,Wen Hwa |
author_facet |
Chen,Wen Hwa Chen,You Wei 陳祐瑋 |
author |
Chen,You Wei 陳祐瑋 |
spellingShingle |
Chen,You Wei 陳祐瑋 Analysis of Roll-to-Roll Gravure Offset Printing Process for Fine Line Electronic Circuitry |
author_sort |
Chen,You Wei |
title |
Analysis of Roll-to-Roll Gravure Offset Printing Process for Fine Line Electronic Circuitry |
title_short |
Analysis of Roll-to-Roll Gravure Offset Printing Process for Fine Line Electronic Circuitry |
title_full |
Analysis of Roll-to-Roll Gravure Offset Printing Process for Fine Line Electronic Circuitry |
title_fullStr |
Analysis of Roll-to-Roll Gravure Offset Printing Process for Fine Line Electronic Circuitry |
title_full_unstemmed |
Analysis of Roll-to-Roll Gravure Offset Printing Process for Fine Line Electronic Circuitry |
title_sort |
analysis of roll-to-roll gravure offset printing process for fine line electronic circuitry |
publishDate |
2016 |
url |
http://ndltd.ncl.edu.tw/handle/45124795760050768450 |
work_keys_str_mv |
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