Theoretical Studies of the Dicing Forces and Temperature Distribution on Wafer Dicing Process
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 104 === In this study, a heat transfer model is established based on the finite difference method to solve heat transfer problems and to predict the temperature distribution of workpiece during the wafer dicing process. Effects of workpiece size, feed rate, blade s...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46963803527343486775 |