| Summary: | 碩士 === 國立高雄第一科技大學 === 電子工程系碩士在職專班 === 104 === This thesis proposes a novel method to simulate and verify the high-speed digital differential signal of PCIExpress-III in IC (Integrated Circuit) tested PCB (printed circuit board). The experimental results can be included by using the properties of electrical impedance, S-parameters and eye diagram.
Firstly, the software HFSS is used to create 3D model of differential signal impedance by controlling and importing different dielectric constants of board material. The scattering parameter of differential signal transmission line is used to select the appropriate medium board material which can meet the high-speed signal design request. The physical test board high-speed has loopback signals, but the signals are transmitted through complicated paths. The paths cause the changes of simulation results. The verification of the method uses Candence Allegro tool for PCB layout design. After that, Ansys SIwave and Ansys Desugner are used for Time Domain reflectometry, S-parameters and eye diagram analysis. The experimental results show that the proposed method has high performance by using PCIExpress-III signal in high-speed PCB testing.
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