Real-time image feedback control for dual-anode local electrochemical deposition system

碩士 === 國立中央大學 === 機械工程學系 === 104 === This research use 75 micrometer platinum wire to be Anode, and separate each other by glass capillary tube. Sulfuric acid to be plating solution and Copper plate to be cathode. Because of some difference occur when both anode produced, which means there must have...

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Bibliographic Details
Main Authors: Hui-Pang You, 游輝邦
Other Authors: Hwang, Yean-ren
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/83wj9v
Description
Summary:碩士 === 國立中央大學 === 機械工程學系 === 104 === This research use 75 micrometer platinum wire to be Anode, and separate each other by glass capillary tube. Sulfuric acid to be plating solution and Copper plate to be cathode. Because of some difference occur when both anode produced, which means there must have something different when you compare with each anode. So that the area of platinum explored to the solution might be different. That might cause the deposition rate different. No matter what kind of handmade way to produce anode, there must a little bit different between them. This research wants to change PWM value by CCD Camera detection to achieve same rate of deposition. This research use one CCD Camera to build an auto plating system, Computed Threshold, Prewitt Operator, Sobel Operator, and so on to define column center. By control method PID adjust Arduino Switch PWM, Can efficiently attempt to same deposition rate and discuss with the robustness and stability.