Graphene and Nanographite Embedded Composites as Thermal Interface Materials For Heat Dissipation Applications

碩士 === 國立中央大學 === 機械工程學系 === 104 === In this thesis, the thermal interface material (Thermal Interface Materials, TIMs) discussion on the development and performance. For high power electronic components easy to produce a large amount of heat, so very hot and the thermal failure of the phenomenon, a...

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Bibliographic Details
Main Authors: Rui-Zhong Lee, 李睿中
Other Authors: 傅尹坤
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/q72a95
Description
Summary:碩士 === 國立中央大學 === 機械工程學系 === 104 === In this thesis, the thermal interface material (Thermal Interface Materials, TIMs) discussion on the development and performance. For high power electronic components easy to produce a large amount of heat, so very hot and the thermal failure of the phenomenon, as electronic component there are many fine cracks on the surface of the formation of thermal resistance, TIMs can be applied to electronic components to fill the gap between components to enhance thermal conductivity. In this study, the study can be divided into two parts, the first part of preparation of Silver Nano Particles (SNPs) and Single Wall Carbon Nanotubes (SWCNTs) using screen printing process on Graphene substrate Board. We will explore the TIM of materials in different directions (In-plane and Through-plane) of electrical conductivity and thermal conductivity and applied to IGBT temperature measurement with aluminium cooling fins. Second part of Graphene powder and Silver Nano Particles mixed with Polydimethylsiloxane (PDMS) using screen printing technology to create thermal interface material and its thermal conductivity.